SW FN2/0xx - Embedded Clustering Software
%3Ablur(10)&w=64&q=75){kind=small}
&w=1920&q=75)
Key features
Fabric Interconnect Networking Software (FIN-S)
Enables socket applications to run seamlessly
Supports PCI Express® and RapidIO® fabrics
Detail
Enables multiple boards from Concurrent Technologies to communicate with each other over a socket interface for clustering Concurrent Technologies Fabric Interconnect Networking Software (FIN-S) is a family of software packages that provides a rich fabric software ecosystem allowing applications on multiple processor boards to communicate with each other.
Product downloads
Channel support
Looking for our channel support site?
Related products
%3Ablur(10)&w=64&q=75){kind=small}
&w=828&q=75)
XP B5x/msd-RC - Rugged Processor XMC module
Rugged conduction-cooled module
Based on 6th Generation Intel® processor
Up to 16GB memory with ECC
Built in Solid State Drive for reliable storage
Wide range of I/O interfaces available on XMC connectors
Support for Linux®, Windows® and VxWorks®
%3Ablur(10)&w=64&q=75){kind=small}
&w=828&q=75)
XP B5x/msd - Processor XMC module
6th Generation Intel® Processor
Solid State Drive for reliable storage
Wide range of I/O interfaces
Extended temperature and rugged versions available
Support for Linux®, Windows® and VxWorks®
%3Ablur(10)&w=64&q=75){kind=small}
&w=828&q=75)
VP F6x/msd-RC - Rugged VME Processor Board
Rugged Conduction-cooled 6U VME processor board
Based on Intel® Xeon® processor E3-1505L v6
Two PMC/XMC sites for I/O expansion
Option for SATA Flash Disk, M.2 module and 2.5-inch storage drives
%3Ablur(10)&w=64&q=75){kind=small}
&w=828&q=75)
VP E2x/msd - VME Processor
VME processor board with low power consumption
Based on Intel® Atom™ E3800 Processor
Up to 2 x XMC/PMC module sites for local I/O expansion
On board solid state disk options
Get in touch
Enquire about the SW FN2/0xx - Embedded Clustering Software
Fill in your details below and a member of the team will get back to you shortly.